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Active & Intelligent Packaging Industry Association

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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

FINAT
Gopsons Papers Ltd.
EMCO Packaging Systems Ltd
Serioplast
Caraustar
D-Group Systems Integrator, Inc.
Intermec by Honeywell USA
American Litho Inc.
Investment Circle GmbH
Iliffe Print
Danaflex
STI Group / STI Petöfi Nyomda Kft.
NAPCO Packaging Impressions
Verhoeven Ontwerpburo
HEINEKEN
Sartorius Stedim Biotech GmbH
ROX Asia Consultancy Ltd.
Securitag Assembly Group Co Ltd
Bosch Sensortec GmbH
Vivainnova
chanwanich security printing
Zircon Technologies India LTD.
Jose Mendoza
Acando Consulting
Marketing Resources Inc.
Scanbuy
INNOVHOPE INC
UpCode
Theodorou
Bakambalaj


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

FINAT
Gopsons Papers Ltd.
EMCO Packaging Systems Ltd
Serioplast
Caraustar
D-Group Systems Integrator, Inc.
Intermec by Honeywell USA
American Litho Inc.
Investment Circle GmbH
Iliffe Print
Danaflex
STI Group / STI Petöfi Nyomda Kft.
NAPCO Packaging Impressions
Verhoeven Ontwerpburo
HEINEKEN
Sartorius Stedim Biotech GmbH
ROX Asia Consultancy Ltd.
Securitag Assembly Group Co Ltd
Bosch Sensortec GmbH
Vivainnova
chanwanich security printing
Zircon Technologies India LTD.
Jose Mendoza
Acando Consulting
Marketing Resources Inc.
Scanbuy
INNOVHOPE INC
UpCode
Theodorou
Bakambalaj
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