Building off the success of its inaugural event, the Active & Intelligent Packaging Summit Americas will return to the greater New York City area this June. The event, co-produced by the Active & Intelligent Packaging Association (AIPIA) and BXP (Brand Experience magazine), will be held June 3-4, 2019 at the Westin Jersey City Newport.
The number of opportunities in China for Active & Intelligent Packaging companies grew tremendously in 2018 and is set to grow even faster this year, according to AIPIA, the Active & Intelligent Packaging Industry Association. To take full advantage of this situation the organisation has announced a full scale Summit on all aspects of A&IP relevant to the Chinese market. The event will take place in Shanghai 18/19 July 2019.