The number of opportunities in China for Active & Intelligent Packaging companies grew tremendously in 2018 and is set to grow even faster this year, according to AIPIA, the Active & Intelligent Packaging Industry Association. To take full advantage of this situation the organisation has announced a full scale Summit on all aspects of A&IP relevant to the Chinese market. The event will take place in Shanghai 18/19 July 2019.
ALL ABOUT DATA MINING, SHELF LIFE, CONSUMER ENGAGEMENT, BRAND AUTHENTICATION AND RECYCLING OPPORTUNITIES BY THE IMPLEMENTATION OF NEW TECHNOLOGIES IN PACKAGING.... It's all in Amsterdam in November!