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Active & Intelligent Packaging Industry Association

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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Stevanato Group

Shrinkpak Solutions

TWL SYSTEMS
Antares Vision
Industry Intelligence
Infineon
Dansensor A/S
Dayton Systems Group
InkSure Technologies
PERFORMANCE PACKAGING
San Plast
NXP
A. Schulman Europe GmbH
Wroclaw University of Science and Technology
Melchers Vietnam
Royston Labels Ltd.
Packology Limited
ScanTrust
HAVI Global Solutions
Conceptual Pathways Inc
Scent Marketing Institute
MONTAJES CONSERVEROS DE GALICIA,S.L.
VISKASE
CS Connect
Miller Graphics AB
Leonhard Kurz Australia Pty Ltd
TruTag Technologies
Rfid Ready
Wells Plastics Ltd
Alsitype Pharma Technologies


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Stevanato Group

Shrinkpak Solutions

TWL SYSTEMS
Antares Vision
Industry Intelligence
Infineon
Dansensor A/S
Dayton Systems Group
InkSure Technologies
PERFORMANCE PACKAGING
San Plast
NXP
A. Schulman Europe GmbH
Wroclaw University of Science and Technology
Melchers Vietnam
Royston Labels Ltd.
Packology Limited
ScanTrust
HAVI Global Solutions
Conceptual Pathways Inc
Scent Marketing Institute
MONTAJES CONSERVEROS DE GALICIA,S.L.
VISKASE
CS Connect
Miller Graphics AB
Leonhard Kurz Australia Pty Ltd
TruTag Technologies
Rfid Ready
Wells Plastics Ltd
Alsitype Pharma Technologies
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