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Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

CSP Technologies (Aptar)
ARC
St. John's Packaging Ltd
Doneck Euroflex
Primepack Technologies Inc.
Innoscentia
Eshuis
Finetti Design
Symphony Environmental USA
Techind Engineers & Consultants-Impex.
Ecolean
Organic Electronic Technologies (OET) P.C.
PPi Technologies Group / Redi-2-DrinQ Group
MicrobeGuard Corporation
Merieux NutriSciences
Brightgreen
Scanlan Graphics Inc
Dracula Technologies
Miwa Management LTD

Spices Chef

Content AI Studios
Print care
AIDA RFID Solutions
Nfinite Nanotech
ScentSational Technologies, LLC
BRASKEM S.A
Micronisers Australasia
Warsaw University of Technology
Cyntra Labs
IDlocate Global Limited


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

CSP Technologies (Aptar)
ARC
St. John's Packaging Ltd
Doneck Euroflex
Primepack Technologies Inc.
Innoscentia
Eshuis
Finetti Design
Symphony Environmental USA
Techind Engineers & Consultants-Impex.
Ecolean
Organic Electronic Technologies (OET) P.C.
PPi Technologies Group / Redi-2-DrinQ Group
MicrobeGuard Corporation
Merieux NutriSciences
Brightgreen
Scanlan Graphics Inc
Dracula Technologies
Miwa Management LTD

Spices Chef

Content AI Studios
Print care
AIDA RFID Solutions
Nfinite Nanotech
ScentSational Technologies, LLC
BRASKEM S.A
Micronisers Australasia
Warsaw University of Technology
Cyntra Labs
IDlocate Global Limited
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