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Active & Intelligent Packaging Industry Association

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Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Pladis
University of West Attica
Packaging Science Center, Inc.
Huntsman Corporation
Design to Print
Boveda, Inc.
NFC-360
Sagentia innovation
Badgequo
Absorbopak Ltd
Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Plastics Color Corporation
Solidus
Zappar

HBK

Tanax
Inland
University of Eastern Finland (UEF)
Reimagine Food
Castrol India Ltd
Ingenus DNA
Microsoft Corporation
Ladeste
Macsa ID
T-Systems
Pars Decor
STARDUST MATERIALS, LLC
Optomech Engineers Pvt Ltd
Polyon Industries
Technopakas, TUB


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Pladis
University of West Attica
Packaging Science Center, Inc.
Huntsman Corporation
Design to Print
Boveda, Inc.
NFC-360
Sagentia innovation
Badgequo
Absorbopak Ltd
Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Plastics Color Corporation
Solidus
Zappar

HBK

Tanax
Inland
University of Eastern Finland (UEF)
Reimagine Food
Castrol India Ltd
Ingenus DNA
Microsoft Corporation
Ladeste
Macsa ID
T-Systems
Pars Decor
STARDUST MATERIALS, LLC
Optomech Engineers Pvt Ltd
Polyon Industries
Technopakas, TUB
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