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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Warsaw University of Technology
University of Sheffield

Jenton DIMACO

NFC Semicon
Wima
Airnov Healthcare Packaging
Greiner Packaging International
Migros Industrie AG (Chocolate Frey AG)
Appetite Creative
L'inno Bureau - Innovation Consultancy Services
Connected Hire
Heinz
Zinergy UK
Elizabeth Arden
Sainmarks Industries (India) private Ltd
KELENN Tech
Poznan University of Economics and Business (PUEB)
Precision Plasma & Sputtering Ltd
Müller Dairy
SCA
MSU School of Packaging
CMC Microsystems
NFC-360
CSM Benelux NV
Tracked Assets
Packaging South Asia/IPPStar.org
Bayer
Smurfit Kappa
Zed Industries Inc.
Topflight Corporation


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Warsaw University of Technology
University of Sheffield

Jenton DIMACO

NFC Semicon
Wima
Airnov Healthcare Packaging
Greiner Packaging International
Migros Industrie AG (Chocolate Frey AG)
Appetite Creative
L'inno Bureau - Innovation Consultancy Services
Connected Hire
Heinz
Zinergy UK
Elizabeth Arden
Sainmarks Industries (India) private Ltd
KELENN Tech
Poznan University of Economics and Business (PUEB)
Precision Plasma & Sputtering Ltd
Müller Dairy
SCA
MSU School of Packaging
CMC Microsystems
NFC-360
CSM Benelux NV
Tracked Assets
Packaging South Asia/IPPStar.org
Bayer
Smurfit Kappa
Zed Industries Inc.
Topflight Corporation
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