Smart packaging business bites

A new whitepaper from AIPIA member Pragmatic looks at the emissions profile of semiconductor manufacturing, and its impact on the carbon footprint of smart products. The paper finds that substituting silicon chips for fit-for-purpose flexible integrated circuits (FlexICs) can reduce energy and resource consumption, both during fabrication and in deployment, reducing the carbon footprint.

Silicon-based semiconductor production has historically had a poor environmental record, relying on vast amounts of water and energy. But Pragmatic’s FlexIC production process removes resource- and energy-intensive steps, resulting in the use of fewer and safer chemicals and gases, and the consumption of substantially less water, it explains...


Part of Smart Packaging for Intelligent Logistics: SEE HERE

« News feed