facebook twitter linked-in
Active & Intelligent Packaging Industry Association

AIPIA
  • News
  • Congress & Exhibition
  • Subscribers & Partners
  • Online Course
  • Press
  • Contact
  1. You are here:
  2. AIPIA
  3. News
  • Newsletter Sign Up

Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

FUJIFILM Dimatix, Inc.
Almac Group
SUN Automation Group
C2CP BV
Graphostyle
Neenah Paper, Inc.
Heidelberger Druckmaschinen AG
Seshaasai
FPC - Beyond Packaging
Fenoplast Ltd
Quantum Technology Group
Nabcore
SAMTACK Industrial Adhesives
R&C Printing Products Solutions Ltd.
Cerulean
KDS Sp.
Vowpack by Vow Packaging Partners Ltd
University of Zaragoza

Pack Performance GmbH

CEC
Bandera Extrusion Intelligence
Fluxy One SIA
Advanced Research Cryptography Ltd
Ferreterro
OxySense Inc.
NXP
Koko Kreativ
Tanax
Immertia
Cadepa Packaging


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

FUJIFILM Dimatix, Inc.
Almac Group
SUN Automation Group
C2CP BV
Graphostyle
Neenah Paper, Inc.
Heidelberger Druckmaschinen AG
Seshaasai
FPC - Beyond Packaging
Fenoplast Ltd
Quantum Technology Group
Nabcore
SAMTACK Industrial Adhesives
R&C Printing Products Solutions Ltd.
Cerulean
KDS Sp.
Vowpack by Vow Packaging Partners Ltd
University of Zaragoza

Pack Performance GmbH

CEC
Bandera Extrusion Intelligence
Fluxy One SIA
Advanced Research Cryptography Ltd
Ferreterro
OxySense Inc.
NXP
Koko Kreativ
Tanax
Immertia
Cadepa Packaging
AIPIA
AWA Conferences & Events
Koningin Wilhelminaplein 13
Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

Congress & Exhibition

Program
Register here
Apply as speaker
Apply for standspace

Members & Partners

Our members & partners
Apply as member/partner
 

Press

Press Releases
Press Department

AIPIA Community

AIPIA Community
AIPIA Connect Members
 

Contact

Stay in contact
Route
© copyright 2026: aipia.info | Privacy Statement & Disclaimer | Sitemap | Halinta frontend by Huis-stijl