facebook twitter linked-in
Active & Intelligent Packaging Industry Association

AIPIA
  • News
  • Congress & Exhibition
  • Subscribers & Partners
  • Alliance
  • Online Course
  • Press
  • Contact
  1. You are here:
  2. AIPIA
  3. News
  • Newsletter Sign Up

Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Cleantech & Beyond
Linkz IM
ECC Corp
The Packaging Society UK
INCPEN
QLIKTAG Software - IoT Smart Products Cloud Platform
Impacx
University of West Attica
Cisper Electronics BV
Fenoplast Ltd
ZAMKO BV

Ryan Systems

NXP
CPI
Toyobo Chemicals Europe GmbH
Macro Plastics
IDlocate Global Limited
H.I.S. Industrie Service
CSP Technologies (Aptar)
risk05
Skanem
EcoTensil
Ahead of the Curve Group
Secure Ink Technology
PSI
Grupo zapata
HP Sustainable Packaging
PDD Studios Inc
American Thermal Instruments

David Sheldon Associates Ltd



Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Cleantech & Beyond
Linkz IM
ECC Corp
The Packaging Society UK
INCPEN
QLIKTAG Software - IoT Smart Products Cloud Platform
Impacx
University of West Attica
Cisper Electronics BV
Fenoplast Ltd
ZAMKO BV

Ryan Systems

NXP
CPI
Toyobo Chemicals Europe GmbH
Macro Plastics
IDlocate Global Limited
H.I.S. Industrie Service
CSP Technologies (Aptar)
risk05
Skanem
EcoTensil
Ahead of the Curve Group
Secure Ink Technology
PSI
Grupo zapata
HP Sustainable Packaging
PDD Studios Inc
American Thermal Instruments

David Sheldon Associates Ltd

AIPIA
AWA Conferences & Events
Koningin Wilhelminaplein 13
Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

Congress & Exhibition

Program
Register here
Apply as speaker
Apply for standspace

Members & Partners

Our members & partners
Apply as member/partner
 

Press

Press Releases
Press Department

AIPIA Community

AIPIA Community
AIPIA Connect Members
 

Contact

Stay in contact
Route
© copyright 2026: aipia.info | Privacy Statement & Disclaimer | Sitemap | Halinta frontend by Huis-stijl