facebook twitter linked-in
Active & Intelligent Packaging Industry Association

AIPIA
  • News
  • Congress & Exhibition
  • Subscribers & Partners
  • Alliance
  • Online Course
  • Press
  • Contact
  1. You are here:
  2. AIPIA
  3. News
  • Newsletter Sign Up

Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Elcoflex Ltd.
Organic Electronic Technologies (OET) P.C.
Sincpress
Shire
Microtrace LLC
Industrial Technology Development Institute
Royal Sens
HID Global
Pont Europe
IdeAtics BV
GA Mobile AB
Laava ID (Aust) Pty Ltd
NFC Forum
eAgile Inc.
Perfotec
Perfektüp Packaging

Noel Mitchell

Aptar
Manipal Technologies Ltd
IPwe
Cellografica Gerosa
Perlman Creative Group
ARANCA
Design to Print
TCS - Life Sciences
Next Level Information Ltd.
Tridimage
Faca Packaging
University of Lincoln
LPC, Inc.


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Elcoflex Ltd.
Organic Electronic Technologies (OET) P.C.
Sincpress
Shire
Microtrace LLC
Industrial Technology Development Institute
Royal Sens
HID Global
Pont Europe
IdeAtics BV
GA Mobile AB
Laava ID (Aust) Pty Ltd
NFC Forum
eAgile Inc.
Perfotec
Perfektüp Packaging

Noel Mitchell

Aptar
Manipal Technologies Ltd
IPwe
Cellografica Gerosa
Perlman Creative Group
ARANCA
Design to Print
TCS - Life Sciences
Next Level Information Ltd.
Tridimage
Faca Packaging
University of Lincoln
LPC, Inc.
AIPIA
AWA Conferences & Events
Koningin Wilhelminaplein 13
Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

Congress & Exhibition

Program
Register here
Apply as speaker
Apply for standspace

Members & Partners

Our members & partners
Apply as member/partner
 

Press

Press Releases
Press Department

AIPIA Community

AIPIA Community
AIPIA Connect Members
 

Contact

Stay in contact
Route
© copyright 2026: aipia.info | Privacy Statement & Disclaimer | Sitemap | Halinta frontend by Huis-stijl