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Active & Intelligent Packaging Industry Association

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  5. Hollister Inc.
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Member & Partner include:

Michigan State University
Precision Plasma & Sputtering Ltd
BANDESUR
Peel Plastic Products Ltd
Windesheim UAS
Manipal Technologies Limited
NFC Tagify
ThePackHub
TPL
StixFresh
Bayer Health Care LLC
LINKWIN
Pars Decor
Total Quality logistics

Fujimori Kogyo co., ltd.

Palladio Group S.p.A
Brandimation
SOREDAB
Techind Engineers & Consultants-Impex.
Overlay Solutions Limited
COCA COLA HELLENIC
Footprint, LLC
Viscofan S.A:
Conceptual Pathways Inc

Spices Chef

TUKU Inc.
SMI Group
ESIReims
AWA Alexander Watson Associates
Smarttech Labels Inc.

Hollister Inc.

Hollister Inc.

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Member & Partner include:

Michigan State University
Precision Plasma & Sputtering Ltd
BANDESUR
Peel Plastic Products Ltd
Windesheim UAS
Manipal Technologies Limited
NFC Tagify
ThePackHub
TPL
StixFresh
Bayer Health Care LLC
LINKWIN
Pars Decor
Total Quality logistics

Fujimori Kogyo co., ltd.

Palladio Group S.p.A
Brandimation
SOREDAB
Techind Engineers & Consultants-Impex.
Overlay Solutions Limited
COCA COLA HELLENIC
Footprint, LLC
Viscofan S.A:
Conceptual Pathways Inc

Spices Chef

TUKU Inc.
SMI Group
ESIReims
AWA Alexander Watson Associates
Smarttech Labels Inc.
AIPIA
AWA Conferences & Events
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Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

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