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Active & Intelligent Packaging Industry Association

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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

EPIC Semiconductors
Intervall Beratung GmbH
Ahlstrom-Munksjo
CMC Microsystems
Innventia
Customer Strategy
Pöyry
Zircon Technologies India LTD.
AVA packaging solutions Ltd.

Fujimori Kogyo co., ltd.

VUbiq Networks
Technopakas, TUB
Boston Scientific
AGMPM
REXOR SAS
NewCO2 BV
Tamper Technologies Ltd
Michigan State University
Sealed Air Nelipak
Imagelinx UK Ltd
A. Schulman Europe GmbH
Aarhus University
WestRock
Imperial Tobacco Ltd
I-CON International
Toronto Metropolitan University (Ryerson)
NEXXT PACKAGING SOLUTIONS
SRV Damage Preventions Pvt. Limited
Toppan America
Sargento Foods, Inc


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

EPIC Semiconductors
Intervall Beratung GmbH
Ahlstrom-Munksjo
CMC Microsystems
Innventia
Customer Strategy
Pöyry
Zircon Technologies India LTD.
AVA packaging solutions Ltd.

Fujimori Kogyo co., ltd.

VUbiq Networks
Technopakas, TUB
Boston Scientific
AGMPM
REXOR SAS
NewCO2 BV
Tamper Technologies Ltd
Michigan State University
Sealed Air Nelipak
Imagelinx UK Ltd
A. Schulman Europe GmbH
Aarhus University
WestRock
Imperial Tobacco Ltd
I-CON International
Toronto Metropolitan University (Ryerson)
NEXXT PACKAGING SOLUTIONS
SRV Damage Preventions Pvt. Limited
Toppan America
Sargento Foods, Inc
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