New NXP chip enhances RFID smart label performance says Checkpoint

Longstanding  AIPIA member Checkpoint Systems, which provides RFID solutions for retail and industry globally, has strengthened its position as an innovator in contactless identification by integrating the powerful new RAIN RFID UCODE® X chip into its smart labels, it says. The new chip has been developed by fellow AIPIA member and major semiconductor manufacturer NXP®.

The UCODE X chip delivers enhanced performance, configurable memory, and outstanding integration flexibility according to the company and further expands Checkpoint Systems’ extensive range of RFID labels. 

By adopting the new NXP chip from its market launch, the company claims this demonstrates its responsiveness and expertise in anticipating market trends, delivering RFID solutions that are ever more efficient and aligned with customers’ ever changing operational challenges.  

This integration enables significant performance improvements—up to -3 dBm in some models—resulting in extended read ranges and greater data reliability for applications such as inventory management, product traceability, and logistics optimization, it states. Checkpoint is one of the first manufacturers to achieve ARC certification from Auburn University RFID Lab for several of its RFID inlays equipped with the new NXP UCODE?X chip. 

Engineered to meet the growing demands of RAIN RFID applications, the chip combines industry-leading read/write sensitivity with fully configurable EPC and user memory, offering advanced flexibility for customized use cases. Compliant with EPC Gen2 standards, UCODE X uses non-proprietary features for seamless integration across widely used RFID inlay formats, ensuring faster, more accurate reads—especially in challenging RFID environments. 

“At Checkpoint Systems, we are committed to embedding the most advanced technologies into our smart labels to provide high-performance, reliable RFID solutions tailored to our customers’ needs,” said Inge Fleuren, global product solutions manager RFID. “The integration of the UCODE X chip perfectly reflects this commitment. We are proud to rely on the recognized expertise of our partner NXP, whose continuous innovation helps us anticipate future market needs.” 

“With UCODE X, we are expanding what is possible in RAIN RFID. Together with our partner Checkpoint and their market-ready solutions, we will accelerate adoption and advance our mission to tag everything with UCODE X—bringing high-performance, standards-based solutions to more products and more markets, added Ralf Kodritsch, senior director, UCODE RFID at NXP. 

ALL AT AIPIA/AWA SMART PACKAGING WORLD CONGRESS 2026

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