The Future of Packaging is Intelligent: AIPIA & AWA Smart Packaging World Congress 2027 | 11-11-2026 |
The AIPIA & AWA Smart Packaging World Congress 2027 will take place on 17-18 June 2027 in Amsterdam, The Netherlands, bringing together brand owners, retailers, packaging companies, technology providers, RFID experts, standards organizations, and innovators to explore the technologies shaping the future of active, intelligent and connected packaging.
As packaging evolves beyond its traditional role, it is becoming a platform for product intelligence, consumer engagement, authentication, traceability, regulatory compliance, improved safety & security, as well as impactful business insights. From RFID-enabled products and Digital Product Passports to AI-driven data, condition monitoring, shelf-life extension and connected consumer experiences, smart packaging is moving rapidly from pilot projects to large-scale implementation. Brand owners have identified intelligent packaging as a key enabler. The Congress will examine how connected products and intelligent packaging technologies are creating value across the entire product lifecycle.
Four Dedicated Conference Tracks: The 2027 programme will focus on four key areas driving industry transformation:
Connected Consumer & Digital Brand Experience: Exploring how brands are creating stronger consumer relationships through connected packaging technologies.
Product Trust, Authentication, Compliance, Condition Monitoring & Digital Product Passports: Focusing on product authentication, anti-counterfeiting, transparency, regulatory compliance, and Digital Product Passports.
Connected Products, RFID & Supply Chain Intelligence: Examining the role of RFID, item-level intelligence, and connected products in improving visibility and operational performance.
AI, Data & the Future of Intelligent Packaging: Highlighting how artificial intelligence, packaging data, and digital technologies are transforming packaging into a source of actionable business intelligence.
New for 2027: AIPIA Innovation Showcase will provide a curated platform for selected SME companies to demonstrate breakthrough technologies and solutions shaping the future of smart packaging. The Showcase will feature innovations spanning RFID, authentication, condition monitoring, Digital Product Passports, consumer engagement, intelligent labelling, connected products, packaging intelligence, indeed any of the latest technologies developed in the active & intelligent packaging sector.
The AIPIA Brand Challenge Returns
The AIPIA Brand Challenge will once again bring together brand owners and technology innovators to solve real-world business challenges through smart packaging.
The Challenge provides a unique platform where brands present genuine packaging, consumer engagement, authentication, sustainability, or supply chain challenges, while technology providers showcase practical solutions that can deliver measurable business value.
The AIPIA & AWA Smart Packaging World Congress continues to serve as a leading platform for collaboration, networking, technology demonstrations, and thought leadership.
Event Details:
AIPIA & AWA Smart Packaging World Congress 2027
? 17-18 June 2027
? Amsterdam, The Netherlands
