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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

EPIC Semiconductors
Quantum Technology Group
The Innovation Society
Amazon Lab126
COMAR
ItoM
PlusPrinters
Engeenuity, llc.
American Thermal Instruments
MTK Services
Etheclo
Kezzler AS
Fix-a-Form International
Chromatic Technologies Inc (CTI)
Bron Groep
NEDTEQ
Mphasis an Hewlett Packard Company
CLC (UK) Ltd.
Packaging automation LTD
Encres DUBUIT
O2 CONTROL
TPG Packaging Consultants Ltd
Shine Forth Co. Ltd
eAgile Inc.
NovaCentrix
Packdesign ID Oy
Micronisers Australasia
EVRYTHNG (a Digimarc Company)
Imprimere Embalagens
Scent Marketing Institute


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

EPIC Semiconductors
Quantum Technology Group
The Innovation Society
Amazon Lab126
COMAR
ItoM
PlusPrinters
Engeenuity, llc.
American Thermal Instruments
MTK Services
Etheclo
Kezzler AS
Fix-a-Form International
Chromatic Technologies Inc (CTI)
Bron Groep
NEDTEQ
Mphasis an Hewlett Packard Company
CLC (UK) Ltd.
Packaging automation LTD
Encres DUBUIT
O2 CONTROL
TPG Packaging Consultants Ltd
Shine Forth Co. Ltd
eAgile Inc.
NovaCentrix
Packdesign ID Oy
Micronisers Australasia
EVRYTHNG (a Digimarc Company)
Imprimere Embalagens
Scent Marketing Institute
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