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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Dynaflex Pvt Ltd
UniMerch
University of West Bohemia
Correvio LLC
AEP Industries
Brady AB
Perfektüp Packaging
Cal Poly Printed Electronics and Functional Imaging
Chocolate Frey AG
CEVA DSP Ltd
LunaLEC AB
PRIZM HOLOGRAPHY AND SECURITY FILMS PVT LTD
Berlin Packaging
Packserve Limited
KU Leuven L-itL University of Leuven
Holoptica, LLC
Sedef
Pulmuone Co., Ltd.
Polyon Industries
DuPont TYVEK
ProData GmbH
McBride,S.A
Talkin’ Things
Organic Electronic Technologies (OET) P.C.
SETAPAK ELEKTRONIK VE AMBALAJ MAKINA SAN. TIC. LTD. STI.
Pelliconi
World Tech Machinery (Pvt) Ltd.
Haas Automation
Weidenhammer Packaging Group
N2 Packaging Systems


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Dynaflex Pvt Ltd
UniMerch
University of West Bohemia
Correvio LLC
AEP Industries
Brady AB
Perfektüp Packaging
Cal Poly Printed Electronics and Functional Imaging
Chocolate Frey AG
CEVA DSP Ltd
LunaLEC AB
PRIZM HOLOGRAPHY AND SECURITY FILMS PVT LTD
Berlin Packaging
Packserve Limited
KU Leuven L-itL University of Leuven
Holoptica, LLC
Sedef
Pulmuone Co., Ltd.
Polyon Industries
DuPont TYVEK
ProData GmbH
McBride,S.A
Talkin’ Things
Organic Electronic Technologies (OET) P.C.
SETAPAK ELEKTRONIK VE AMBALAJ MAKINA SAN. TIC. LTD. STI.
Pelliconi
World Tech Machinery (Pvt) Ltd.
Haas Automation
Weidenhammer Packaging Group
N2 Packaging Systems
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