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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

TICTAG
EPIC Semiconductors
U-NICA
Universidade da Beira Interior
Campanil Ltda
Intelligent Material Solutions Inc
Valydpack
University of Illinois

Tenschul

LasX
Andaltec, Plastic Technological Center
CERM
Digimock
NATco
Wageningen UR
MantiSpectra B.V.
AGI Shorewood
Avery Dennison Smartrac
plaesa
Cryptocycle
Decco
Arylla
Bumaga
WeLL Design
Matthews Europa
PackSave Products & Services Ltd
Federal University of Sao Carlos (UFSCar)
Puratos NV/SA
Blyott
MM Barcoding


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

TICTAG
EPIC Semiconductors
U-NICA
Universidade da Beira Interior
Campanil Ltda
Intelligent Material Solutions Inc
Valydpack
University of Illinois

Tenschul

LasX
Andaltec, Plastic Technological Center
CERM
Digimock
NATco
Wageningen UR
MantiSpectra B.V.
AGI Shorewood
Avery Dennison Smartrac
plaesa
Cryptocycle
Decco
Arylla
Bumaga
WeLL Design
Matthews Europa
PackSave Products & Services Ltd
Federal University of Sao Carlos (UFSCar)
Puratos NV/SA
Blyott
MM Barcoding
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