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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

The Goldstein Group
Clemson University
University College Cork
PIRLO
Gejo Interpack
Hitech Plast Ltd.
Central Piedmont Community College
CEC
Turkish Food Safety Association
University Bonn, Cold-Chain Management Group
Maquinas Agricolas Jacto
Advanced Box & Packaging Solutions, LLC
Arjowiggins Creative Papers
Sinclair Systems International
Ecolean
Berlinger Group
WOZ.AI
KD Services
Verhaert New Products & Services
National Research Council Canada
Sincpress
Profit Protection Services
West Pak Avocado, Inc.
Skypack India
Bandall B.V.
Direct Packaging Ltd
Cisper Electronics BV
Narita design & strategy
STRATA
Chapter Press Limited


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

The Goldstein Group
Clemson University
University College Cork
PIRLO
Gejo Interpack
Hitech Plast Ltd.
Central Piedmont Community College
CEC
Turkish Food Safety Association
University Bonn, Cold-Chain Management Group
Maquinas Agricolas Jacto
Advanced Box & Packaging Solutions, LLC
Arjowiggins Creative Papers
Sinclair Systems International
Ecolean
Berlinger Group
WOZ.AI
KD Services
Verhaert New Products & Services
National Research Council Canada
Sincpress
Profit Protection Services
West Pak Avocado, Inc.
Skypack India
Bandall B.V.
Direct Packaging Ltd
Cisper Electronics BV
Narita design & strategy
STRATA
Chapter Press Limited
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