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Active & Intelligent Packaging Industry Association

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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

SunChemical
Signode India Limited
Boikon B.V.
Lucelo Technologies, Inc.
Vizbee SAS
Royal Paardekooper Group
Lion
Uganda National Bureau of Standards
Content AI Studios

Social Dot Australia

Iliffe Print
Phototype
ECC Corp
Star
Danaflex
AWA Alexander Watson Associates
Baden Board
Product Boxes (Australia)
Freedonia Group Inc.
Toronto Metropolitan University (Ryerson)
CTCPA
Alpha Assembly Solutions
Lead Packaging Technologies
Eatit Oy
ITEGA
MOKA EFTI SPA
Holoprint Security Solutions Fz LLC
Nvirovate Materials Inc.
Nypro - A Jabil Company
Epicor Software (formerly Solarsoft)


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

SunChemical
Signode India Limited
Boikon B.V.
Lucelo Technologies, Inc.
Vizbee SAS
Royal Paardekooper Group
Lion
Uganda National Bureau of Standards
Content AI Studios

Social Dot Australia

Iliffe Print
Phototype
ECC Corp
Star
Danaflex
AWA Alexander Watson Associates
Baden Board
Product Boxes (Australia)
Freedonia Group Inc.
Toronto Metropolitan University (Ryerson)
CTCPA
Alpha Assembly Solutions
Lead Packaging Technologies
Eatit Oy
ITEGA
MOKA EFTI SPA
Holoprint Security Solutions Fz LLC
Nvirovate Materials Inc.
Nypro - A Jabil Company
Epicor Software (formerly Solarsoft)
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