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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

NanoTag Technology Pty Ltd
AVA packaging solutions Ltd.

NEX-XOS

Medoola
New York Label & Box Works
Post Harvest Technologies Pvt. Ltd.
Washington State University
OPTEL Group
CETEA - Packaging Technology Center
Scanbuy
3D Click
Microtrace LLC
Pelling Frank Jack Albert
Shanghai Hengyuan Macromolecular Materials Co.Ltd.
Intermec by Honeywell USA
The Less Packaging Company Ltd
Hallmark
Collotype Labels Pty Ltd
Imagelinx UK Ltd
JP Laboratories Inc
Shine Forth Co. Ltd
Miko Pac NV
Parkside Flexibles
Coverpan s.l.
EuroFoil Teo
C&C Joint Printing (HK) Ltd
E Ink Corporation
Acket Drukkerij Kartonnage BV
Tracworx
Europack Bulgaria Ltd


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

NanoTag Technology Pty Ltd
AVA packaging solutions Ltd.

NEX-XOS

Medoola
New York Label & Box Works
Post Harvest Technologies Pvt. Ltd.
Washington State University
OPTEL Group
CETEA - Packaging Technology Center
Scanbuy
3D Click
Microtrace LLC
Pelling Frank Jack Albert
Shanghai Hengyuan Macromolecular Materials Co.Ltd.
Intermec by Honeywell USA
The Less Packaging Company Ltd
Hallmark
Collotype Labels Pty Ltd
Imagelinx UK Ltd
JP Laboratories Inc
Shine Forth Co. Ltd
Miko Pac NV
Parkside Flexibles
Coverpan s.l.
EuroFoil Teo
C&C Joint Printing (HK) Ltd
E Ink Corporation
Acket Drukkerij Kartonnage BV
Tracworx
Europack Bulgaria Ltd
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