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Active & Intelligent Packaging Industry Association

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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Illing Company
Wroclaw University of Science and Technology
Lamb Weston Meijer vof
Janssen R&D
Hamelin
NOVA School of Science and Technology
LEREM

David Sheldon Associates Ltd

Mac Papers
Near Field Solutions Ltd
Luchrome
Plastics Color Corporation
Techindia software
CIT Technology Ltd.
Tag-it Tech, Inc.
STMicroelectronics
Shandong Xianglong New Materials Corp
Aegis Packaging
Aayam
Super pack industries
Alitheon Inc
Flex Alert
CK&B Co.,Ltd
Wisesorbent Technology
Impakt Packaging
Investment Circle GmbH
One Stop Print Solutions LLC
Sensitech Inc.
American Garden
ShipChain


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Illing Company
Wroclaw University of Science and Technology
Lamb Weston Meijer vof
Janssen R&D
Hamelin
NOVA School of Science and Technology
LEREM

David Sheldon Associates Ltd

Mac Papers
Near Field Solutions Ltd
Luchrome
Plastics Color Corporation
Techindia software
CIT Technology Ltd.
Tag-it Tech, Inc.
STMicroelectronics
Shandong Xianglong New Materials Corp
Aegis Packaging
Aayam
Super pack industries
Alitheon Inc
Flex Alert
CK&B Co.,Ltd
Wisesorbent Technology
Impakt Packaging
Investment Circle GmbH
One Stop Print Solutions LLC
Sensitech Inc.
American Garden
ShipChain
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