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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

International Iberian Nanotechnology Laboratory
Topflight Corporation
SETAPAK ELEKTRONIK VE AMBALAJ MAKINA SAN. TIC. LTD. STI.
Federal University of Sao Carlos (UFSCar)
Quad Graphics
Sagentia innovation
EXANTE LTD
Konvoy
EuroFoil Teo
Sinclair Systems International
Delivr Corporation
Designlynx
Verhaert New Products & Services
Hallmark
Ceradrop
StixFresh
Bunzl
Fashion Cosmetic Packaging co. Ltd.
RAQAM International Labels & Ribbons Factory
Micronisers Australasia
ECC Corp
Newave Sensor Solutions
Recycl3R solutions SL
Packaginginfo
Lead Packaging Technologies
WISeKey
One Stop Print Solutions LLC

Magic Add

Pyrotec
Rapid Action Packaging


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

International Iberian Nanotechnology Laboratory
Topflight Corporation
SETAPAK ELEKTRONIK VE AMBALAJ MAKINA SAN. TIC. LTD. STI.
Federal University of Sao Carlos (UFSCar)
Quad Graphics
Sagentia innovation
EXANTE LTD
Konvoy
EuroFoil Teo
Sinclair Systems International
Delivr Corporation
Designlynx
Verhaert New Products & Services
Hallmark
Ceradrop
StixFresh
Bunzl
Fashion Cosmetic Packaging co. Ltd.
RAQAM International Labels & Ribbons Factory
Micronisers Australasia
ECC Corp
Newave Sensor Solutions
Recycl3R solutions SL
Packaginginfo
Lead Packaging Technologies
WISeKey
One Stop Print Solutions LLC

Magic Add

Pyrotec
Rapid Action Packaging
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