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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Aegis Packaging
Invengo Technology Pte Ltd
Pro Carton
Sedef
YD Ynvisible, S.A.
Tapwow
Uteco Group
NFC Forum
VDGLAB S.r.l
RB
VR intelligence S.A
Cellr Pty Ltd
Plastopil
Bericap
The Fast Packaging
MillerCoors
TAL-solutions GbR
BRF
BRASKEM S.A
EQpack AB
EREDI CAIMI
Frisense Ltd
Mac Papers
Coca-Cola Africa (Pty)
Bouwkracht
NOVA School of Science and Technology
Ducare
Almac Group
Kellogg India Pvt Ltd


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Aegis Packaging
Invengo Technology Pte Ltd
Pro Carton
Sedef
YD Ynvisible, S.A.
Tapwow
Uteco Group
NFC Forum
VDGLAB S.r.l
RB
VR intelligence S.A
Cellr Pty Ltd
Plastopil
Bericap
The Fast Packaging
MillerCoors
TAL-solutions GbR
BRF
BRASKEM S.A
EQpack AB
EREDI CAIMI
Frisense Ltd
Mac Papers
Coca-Cola Africa (Pty)
Bouwkracht
NOVA School of Science and Technology
Ducare
Almac Group
Kellogg India Pvt Ltd
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