facebook twitter linked-in
Active & Intelligent Packaging Industry Association

AIPIA
  • News
  • Congress & Exhibition
  • Subscribers & Partners
  • Online Course
  • Press
  • Contact
  1. You are here:
  2. AIPIA
  3. News
  • Newsletter Sign Up

Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Sri Vinayaga Enterprises
EPIC Semiconductors
PMS Nederland
Swansea University
Voyantic

AGRITECH PPLICATIONS EXIM

ARANCA
CoreRfid
Nefab Packaging UK Ltd
Packbridge
Propagroup
Grupo zapata
Impacx

Shrinkpak Solutions

VIP Packaging
TQualitas
CHEP
Finetti Design
Label Manufacturers Australia
Murata Electronics Europe B.V.
DANONE Nutricia Research
Pladis
NFC Semicon
Quad Graphics
DBL Gas Solutions
Secure Ink Technology
Starbucks Coffee Company
VUbiq Networks
Smooth & Sharp Corporation
Apio Inc.


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

Sri Vinayaga Enterprises
EPIC Semiconductors
PMS Nederland
Swansea University
Voyantic

AGRITECH PPLICATIONS EXIM

ARANCA
CoreRfid
Nefab Packaging UK Ltd
Packbridge
Propagroup
Grupo zapata
Impacx

Shrinkpak Solutions

VIP Packaging
TQualitas
CHEP
Finetti Design
Label Manufacturers Australia
Murata Electronics Europe B.V.
DANONE Nutricia Research
Pladis
NFC Semicon
Quad Graphics
DBL Gas Solutions
Secure Ink Technology
Starbucks Coffee Company
VUbiq Networks
Smooth & Sharp Corporation
Apio Inc.
AIPIA
AWA Conferences & Events
Koningin Wilhelminaplein 13
Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

Congress & Exhibition

Program
Register here
Apply as speaker
Apply for standspace

Members & Partners

Our members & partners
Apply as member/partner
 

Press

Press Releases
Press Department

AIPIA Community

AIPIA Community
AIPIA Connect Members
 

Contact

Stay in contact
Route
© copyright 2026: aipia.info | Privacy Statement & Disclaimer | Sitemap | Halinta frontend by Huis-stijl