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New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

University of Lincoln
Mei Wei Ltd (O2 Zero)
YPB Group Ltd
Boegli-Gravures SA
AkzoNobel Packaging Coatings
ATG Service GmbH
HID Global
Nanotech Security
OLED Technologies & Solutions
Ladeste
Maxim Labeling & Packaging
Ahlstrom-Munksjo
SUPzero
Imprimere Embalagens
Wasdell Group
GAIKER
Eskesen Advisory
VIP Packaging
Aptar
Hollister Inc.
Bericap
A2B-online B.V.
JDE
Inductive Intelligence
Readability
Smartlid
Kemtek Imaging Systems
American Packaging Corporation

EUROBOX

CIT Technology Ltd.


Other news


New NXP chip enhances RFID smart label performance says Checkpoint DataLase launches label-free clear-to-white coating for laser imaging on plastic bottles Tageos announced a strategic partnership with ambient IoT pioneer Wiliot Intelligent shrink sleeve label aimed at beauty and makeup markets Identiv wins award for solution that verifies authenticity of both bottle and wine Advancing universal accessibility through HD InfoCode+ Avery Dennison Report: , “Food waste has become an accepted cost of doing business” Active Packaging extends shelf life of pears, helping to reduce waste in supply chains US Army engineers develop packaging to extend shelf life, reduce waste and harness and store energy Koenig & Bauer ‘revolutionises’ brand communication with new digital tool on packaging

Member & Partner include:

University of Lincoln
Mei Wei Ltd (O2 Zero)
YPB Group Ltd
Boegli-Gravures SA
AkzoNobel Packaging Coatings
ATG Service GmbH
HID Global
Nanotech Security
OLED Technologies & Solutions
Ladeste
Maxim Labeling & Packaging
Ahlstrom-Munksjo
SUPzero
Imprimere Embalagens
Wasdell Group
GAIKER
Eskesen Advisory
VIP Packaging
Aptar
Hollister Inc.
Bericap
A2B-online B.V.
JDE
Inductive Intelligence
Readability
Smartlid
Kemtek Imaging Systems
American Packaging Corporation

EUROBOX

CIT Technology Ltd.
AIPIA
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