Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
StirlingFildes
Intelleflex
Coverpan s.l.
Be4ward Ltd.
Fr.Schiettinger KG
Engilico
SIES GST-Department of Printing and Packaging Technology Engineering
E Ink Corporation
MDTi
Albis Plastic GmbH
Rolling Optics AB
Iliffe Print
MSU School of Packaging
The Linde Group
Blockstore Finland
Nulogy
COLORs
EcoTensil
Multiplastics (Europe) Ltd
Eco PakTrak, Inc
SussexIM
Micronisers Australasia
Tecksay Technology Company
Pack Print Solutions Pvt. Ltd.
AkzoNobel Packaging Coatings
Cellografica Gerosa, S.A.
Organic Electronic Technologies (OET) P.C.
Clemson University
NAPCO Packaging Impressions