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Active & Intelligent Packaging Industry Association

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Member & Partner include:

Paper Pak Industries
Washington State University

Noel Mitchell

Colep Packaging
Connected Hire
O2 ZERO
All-Pac
Tecksay Technology Company
politecnico torino
CHEP
Finetti Design
XU YUAN Packaging Technology Ltd
DIR Technologies
PACK EKO
American Packaging Corporation
The Less Packaging Company Ltd
NATco
Ingenia Technology Ltd
COMATEC-LANS Laboratory of Applied NanoSciences
eAgile Inc.
Secure Ink Technology
MSU School of Packaging
Ahrma
Greenfield Solution London Ltd
Reckitt Benckiser
Designlynx
Diagramm Halbach
Van Hest Packaging Concepts
WECO Electrical Connectors
OMNOVA SOLUTIONS


Member & Partner include:

Paper Pak Industries
Washington State University

Noel Mitchell

Colep Packaging
Connected Hire
O2 ZERO
All-Pac
Tecksay Technology Company
politecnico torino
CHEP
Finetti Design
XU YUAN Packaging Technology Ltd
DIR Technologies
PACK EKO
American Packaging Corporation
The Less Packaging Company Ltd
NATco
Ingenia Technology Ltd
COMATEC-LANS Laboratory of Applied NanoSciences
eAgile Inc.
Secure Ink Technology
MSU School of Packaging
Ahrma
Greenfield Solution London Ltd
Reckitt Benckiser
Designlynx
Diagramm Halbach
Van Hest Packaging Concepts
WECO Electrical Connectors
OMNOVA SOLUTIONS
AIPIA
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1062 HH  Amsterdam
The Netherlands

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