facebook twitter linked-in
Active & Intelligent Packaging Industry Association Active & Intelligent Packaging Industry Association

The Global Smart Packaging Hub


AIPIA
  • News
  • Congress & Exhibition
  • Members & Partners
  • Alliance
  • Online Course
  • Press
  • Contact
  1. You are here:
  2. AIPIA

Member & Partner include:

William Reed
Toshiba TEC Europe
Rovipak Packaging Solutions
Berlin Packaging
McBride,S.A
INOVEO Concept
J.S. Hamilton Poland S.A.
Tagonic
H.I.S. Industrie Service
LTL Packaging Center
Koko Kreativ
True Pedigree
IMPINJ
Campden BRI
Loughborough University
Suba Solutions Pvt. Ltd.
Iliffe Print
Weber Markig Sytems BV
Ecolean
Toronto Metropolitan University (Ryerson)
IKEA
Chip2Foil
Linkit Concept Oy
Husky IMS Ltd.
SUPzero
Rexam
Precision Plasma & Sputtering Ltd
FinePack
Nestle Purina
NFC Semicon


Member & Partner include:

William Reed
Toshiba TEC Europe
Rovipak Packaging Solutions
Berlin Packaging
McBride,S.A
INOVEO Concept
J.S. Hamilton Poland S.A.
Tagonic
H.I.S. Industrie Service
LTL Packaging Center
Koko Kreativ
True Pedigree
IMPINJ
Campden BRI
Loughborough University
Suba Solutions Pvt. Ltd.
Iliffe Print
Weber Markig Sytems BV
Ecolean
Toronto Metropolitan University (Ryerson)
IKEA
Chip2Foil
Linkit Concept Oy
Husky IMS Ltd.
SUPzero
Rexam
Precision Plasma & Sputtering Ltd
FinePack
Nestle Purina
NFC Semicon
AIPIA
DFP Holding BV
Predikherenstraat 5
3512 TL  Utrecht
The Netherlands
Visiting address:
Wolvenplein 27, Utrecht

Congress & Exhibition

Program
Register here
Apply as speaker
Apply for standspace

Members & Partners

Our members & partners
Apply as member/partner
 

Press

Press Releases
Press Department

AIPIA Community

AIPIA Community
AIPIA Connect Members
 

Contact

Stay in contact
Route
© copyright 2025: aipia.info | Privacy Statement & Disclaimer | Sitemap | Halinta frontend by Huis-stijl