Active & Intelligent Packaging Industry Association

The Global Smart Packaging Hub



Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Kongu Engineering College
University of Economics in Bratislava
Drukkerij Zwart BV
Rofin-Baasel UK Ltd.
Leon L. Bekowitz Company
KM Packaging
BECK Tiefdruckformen
Scent Marketing Institute
Sonoco-Trident
Hohlflex ag
Analog & Tech
Packaging Europe
ERGIS S.A.
Snapsil Corporation
The Dow Chemical Company
Hewlett-Packard
ITbyCLOUD SE
Wasdell Group
Embalajes Capsa, S.L.
Unifresh Group of Companies
UPS
DuPont Packaging Graphics
Arjobex SAS
TecSense GmbH
Manroland Latina
Atria Finland Ltd
StealthCode
Colep Packaging
Manipal Technologies Limited