Active & Intelligent Packaging Industry Association

The Global Smart Packaging Hub



Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Siam Toppan Packaging
OxySense Inc.
Institute of Packaging Professionals
MCI Brand Appeal

AGRITECH PPLICATIONS EXIM
EM Microelectronic
Metalvuoto S.p.A.
TICTAG
Cambridge Design Partnership
KD Services
Yaskawa Motoman Canada Ltd.
Orient Press Ltd.
bridge2market
Pooling Partners
OKTICS ATZ SL
Encres DUBUIT
RAKO-GROUP
HP Indigo
San Plast
Flowe-Pac
Eshuis
Manipal Technologies Ltd
Tiama
PACK EKO
The Linde Group
A. Hatzopoulos S.A.
Packdesign ID Oy
Innoscentia
OET