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Active & Intelligent Packaging Industry Association

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Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
AWA Alexander Watson Associates
Schaefer Container Systems

Ryan Systems

Tridimage
ITbyCLOUD SE
Packaging South Asia/IPPStar.org
UniqueID
IMPRESIONES JM RAMOS MEJIA SA
GS1 US
Organic Electronic Technologies (OET) P.C.
Government Institute of Printing Technology, Mumbai
DSS Plastics Group
The Innovation Society
NEDTEQ
Toshiba TEC Europe
Logmore Ltd.
Sunrise Packaging
Delta ModTech
Alpes Packaging
Wing Fat RyPax
Acando Consulting
CIT Technology Ltd.
PMD
Macleodglba
Saarland University
Almeria University
The Aurora Ceres Partnership Ltd
Narita design & strategy
HP Sustainable Packaging


Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
AWA Alexander Watson Associates
Schaefer Container Systems

Ryan Systems

Tridimage
ITbyCLOUD SE
Packaging South Asia/IPPStar.org
UniqueID
IMPRESIONES JM RAMOS MEJIA SA
GS1 US
Organic Electronic Technologies (OET) P.C.
Government Institute of Printing Technology, Mumbai
DSS Plastics Group
The Innovation Society
NEDTEQ
Toshiba TEC Europe
Logmore Ltd.
Sunrise Packaging
Delta ModTech
Alpes Packaging
Wing Fat RyPax
Acando Consulting
CIT Technology Ltd.
PMD
Macleodglba
Saarland University
Almeria University
The Aurora Ceres Partnership Ltd
Narita design & strategy
HP Sustainable Packaging
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