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Active & Intelligent Packaging Industry Association

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Member & Partner include:

next generation packaging
Warsaw University of Technology
Heidelberger Druckmaschinen AG
Grupo Zapata
Graham Packaging Europe
Shiro Inoue Design
Toppan Printing
ANE
LAB ID srl
ePac Flexible Packaging
MicrobeGuard Corporation
Illing Company
Van Genechten Packaging
C&C Joint Printing (HK) Ltd
Pont Europe
EHRNO flexible a/s
Shandong Xianglong New Materials Corp
Buddybox
MiProbes
Danone
Sagentia innovation
iDi Pac Limited
Ladeste
Tapps
Toshiba TEC Europe
BASF NUNHEMS
REXOR SAS
ROMACO
TechCentrix
Weaveron


Member & Partner include:

next generation packaging
Warsaw University of Technology
Heidelberger Druckmaschinen AG
Grupo Zapata
Graham Packaging Europe
Shiro Inoue Design
Toppan Printing
ANE
LAB ID srl
ePac Flexible Packaging
MicrobeGuard Corporation
Illing Company
Van Genechten Packaging
C&C Joint Printing (HK) Ltd
Pont Europe
EHRNO flexible a/s
Shandong Xianglong New Materials Corp
Buddybox
MiProbes
Danone
Sagentia innovation
iDi Pac Limited
Ladeste
Tapps
Toshiba TEC Europe
BASF NUNHEMS
REXOR SAS
ROMACO
TechCentrix
Weaveron
AIPIA
AWA Conferences & Events
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1062 HH  Amsterdam
The Netherlands

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