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Active & Intelligent Packaging Industry Association

AIPIA
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Member & Partner include:

University College Cork
Systech Illinois
STMicroelectronics
worldbakers.com
ZAMKO BV
UpCode
Fresh Inset SA
Korea Conformity Laboratories
Footprint, LLC
NAPCO Packaging Impressions
Design to Print
Intermec by Honeywell USA
ANFOSE
Heavey Technology
LEWIS MOBERLY
Perlman Creative Group
Perfektüp Packaging
Starcke Oy
Analog & Tech
Multivac
WestRock

GreenS Systems Co Ltd

LECTA-Torraspapel
FuturePack CIC
Nfinite Nanotech
BOTTA PACKAGING
IER
Gojo Industries
Enfucell Oy
GP Solutions UK Ltd


Member & Partner include:

University College Cork
Systech Illinois
STMicroelectronics
worldbakers.com
ZAMKO BV
UpCode
Fresh Inset SA
Korea Conformity Laboratories
Footprint, LLC
NAPCO Packaging Impressions
Design to Print
Intermec by Honeywell USA
ANFOSE
Heavey Technology
LEWIS MOBERLY
Perlman Creative Group
Perfektüp Packaging
Starcke Oy
Analog & Tech
Multivac
WestRock

GreenS Systems Co Ltd

LECTA-Torraspapel
FuturePack CIC
Nfinite Nanotech
BOTTA PACKAGING
IER
Gojo Industries
Enfucell Oy
GP Solutions UK Ltd
AIPIA
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Koningin Wilhelminaplein 13
Tower 1, Floor 10, Unit 12

1062 HH  Amsterdam
The Netherlands

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