Active & Intelligent Packaging Industry Association


Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS

Hyman Topbon Technology Group
Aspen Australia
DigiPlan TEC Inc.
Tecksay Technology Company
Hitech Plast Ltd.
Coveme
Holoflex Limited
YPB Group Ltd
Andrew James UK Ltd.
Royston Labels Ltd.
MillerCoors
Aegis Packaging
TIANJIN BOYUAN NEW MATERIALS
ProxiGroup
Geo Tag, LLC
Konvoy
Zircon Technologies India LTD.
Sensitech Inc.
Sincpress
Sasken Communication and Technologies Ltd
TecSense GmbH
Husky IMS Ltd.
Newell Brands
Systech International
Cellr Pty Ltd
ECCT B.V.
Checkpoint Systems