Active & Intelligent Packaging Industry Association

The Global Smart Packaging Hub



Member & Partner include:

University of Eastern Finland (UEF)

HBK
Next Level Information Ltd.
manroland Goss (India)
Philip Morris International
PakSense
San Plast
HID Global
Leo Burnett
Precision Plasma & Sputtering Ltd
Wroclaw University of Science and Technology
Heidelberger Druckmaschinen AG
WestRock
Narita design & strategy
Packaginginfo
Fix-a-Form International
Miller Graphics AB
Kyodo Printing Co. Ltd
Linkit Concept Oy
CMC Microsystems
Johnsonville Sausage
Intergraf
Boehringer Ingelheim Animal Health GmbH
Scanlan Graphics Inc
Sedef
SpotSee
University of Sheffield
Holmen
Laava ID (Aust) Pty Ltd
Pixel Artists Design