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Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Pantec GS Systems AG
TWL SYSTEMS
Plantronics
Eastman Kodak Company
LENNART Group
MillerCoors
Packaginginfo
Hillphoenix
Avery Dennison Smartrac
Teinnivations LLC
Arylla
Wroclaw University of Science and Technology
Clearpack Automation Private Ltd
ZAMKO BV
Gdansk University of Technology
Sealed Air
INOVEO Concept
FTA Europe
Stampatech
Toppan America
Multiplastics (Europe) Ltd
William Reed
BRF
AlmaScience
Returpack AB
Danaflex
Veritrace
Smart-InPack Consulting
Kongu Engineering College


Member & Partner include:

Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Pantec GS Systems AG
TWL SYSTEMS
Plantronics
Eastman Kodak Company
LENNART Group
MillerCoors
Packaginginfo
Hillphoenix
Avery Dennison Smartrac
Teinnivations LLC
Arylla
Wroclaw University of Science and Technology
Clearpack Automation Private Ltd
ZAMKO BV
Gdansk University of Technology
Sealed Air
INOVEO Concept
FTA Europe
Stampatech
Toppan America
Multiplastics (Europe) Ltd
William Reed
BRF
AlmaScience
Returpack AB
Danaflex
Veritrace
Smart-InPack Consulting
Kongu Engineering College
AIPIA
DFP Holding BV
Predikherenstraat 5
3512 TL  Utrecht
The Netherlands
Visiting address:
Wolvenplein 27, Utrecht

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