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Active & Intelligent Packaging Industry Association Active & Intelligent Packaging Industry Association

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Member & Partner include:

next generation packaging
Nofima
Skypack India
Viatris
Label Manufacturers Australia
Epicor Software (formerly Solarsoft)
Michigan State University
Ames & McBain, Inc.
PragmatIC Semiconductor Ltd
Uteco Group

Magic Add

Smooth & Sharp Corporation
Thin Film Electronics ASA
Axess Technologies Ltd.
Motif
TecSense GmbH
Weaveron
Optomech Engineers Pvt Ltd
XU YUAN Packaging Technology Ltd
Marks and Spencer
Carpathian Industries LLC
Toyo Ink Co Ltd
Britvic
Design to Print
Hohlflex ag
Nanotechnology Industries Association
Muller Camacho Design
CBX
CHEP
Si-Cal Technologies


Member & Partner include:

next generation packaging
Nofima
Skypack India
Viatris
Label Manufacturers Australia
Epicor Software (formerly Solarsoft)
Michigan State University
Ames & McBain, Inc.
PragmatIC Semiconductor Ltd
Uteco Group

Magic Add

Smooth & Sharp Corporation
Thin Film Electronics ASA
Axess Technologies Ltd.
Motif
TecSense GmbH
Weaveron
Optomech Engineers Pvt Ltd
XU YUAN Packaging Technology Ltd
Marks and Spencer
Carpathian Industries LLC
Toyo Ink Co Ltd
Britvic
Design to Print
Hohlflex ag
Nanotechnology Industries Association
Muller Camacho Design
CBX
CHEP
Si-Cal Technologies
AIPIA
DFP Holding BV
Predikherenstraat 5
3512 TL  Utrecht
The Netherlands
Visiting address:
Wolvenplein 27, Utrecht

Congress & Exhibition

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